DesignCon next edition date updated

Da02 febbraio 2027 fino a quandoFebbraio 04, 2027
https://www.designcon.com/en/home.html

DesignCon Overview

DesignCon is the premier high-speed communications and system design conference and exposition for chip, board, and systems design engineers. It offers industry-critical engineering education and showcases the latest tools, trends, and technologies in the heart of Silicon Valley.

Programma di conferenza

The expertly curated 15-track conference features technical paper sessions, tutorials, and industry panels covering all aspects of electronic design. Key topics include:

  • Signal and power integrity
  • High-speed link design
  • Machine learning applications
  • Chip, board, and systems design

Expo Highlights

La sala espo ospita centinaia di nuovi prodotti e tecnologie, fornendo demo interattive e opportunità di networking con i migliori fornitori. Le caratteristiche principali includono:

  • Chiphead Sessioni didattiche teatrali
  • Keynote presentazioni di visionari del settore
  • Manifestazioni del prodotto dal vivo

premi

DesignCon recognizes excellence through several awards, most notably the Engineer of the Year Award, which honors leadership and creativity in the design and test of chips, boards, or systems, with a focus on signal and power integrity. Additional recognitions include Best Paper Awards and the 40 Under 40 program.